Bondexpo 2024

Information

Bondexpo 2024
  • Bondexpo 2024
  • International trade fair for bonding technology, Co-located with Motek.
  • Oct 08 - Oct 11,   2024
  • Stuttgart Exhibition Centre
  • Stuttgart , Germany
  • P.E. Schall Gmbh & Co. KG
  • THETW Co., Ltd.

Market Introduction

【Bondexpo 2022】

There were 24,236 visitors from 864 countries and 505 exhibitors from 24 countries.

Overall floor space: 45,000 sqm

 

Exhibition Introduction

About Bondexpo

Bondexpo is the world’s number one industry and user meeting place. With a clear and consistent focus on the joining/bonding process chain through adhesive bonding, potting, sealing and foaming, the company offers cost-effective detailed and system solutions for current and future challenges in the field of joining and bonding a wide range of materials. This applies not least to new requirements in terms of resource conservation and material and energy efficiency through material mix/hybrid designs for lightweight construction or miniaturization for microsystem technology applications. Suppliers of adhesive bonding technology will find the ideal setting here to present themselves to a trade audience from the globalized world of production.


 

Exhibited Main Products List

  • Assembly systems and basic systems
  • Handling technology
  • Process technology for joining, machining, inspection and
  • identification
  • Components for special machine manufacturing
  • Software and services